RF and SiliconPhotonics Radiation-Hard Circuits for High-Speed Links in Aerospace and High Energy Physics Applications

The increase in number of sensors and bandwidth used on-board satellites for
telecommunications, remote sensing and science missions, leads to an increased frequency and
data-rate requirements for on-board equipments, as recently demonstrated by the publication
of the Spacefiber standard by ESA, May 2019.
The Spacefiber technology aims at a data-rate of 6.25 Gbps for each link, replacing the previous Spacewire standard, which was sized for data-rates of hundreds of Mbps. Spacefiber sustains both electric and optical physical layers. In High Energy Physics applications, the target data rates may be even higher
At University of Pisa, I-CAS lab (https://www.dii.unipi.it/integrated-embedded-circuits-systems-lab)
in close collaboration with other institutes like INFN, CERN, IMEC we are developing all the integrated building blocks able to face harsh aerospace environments in both RF silicon and silicon-photonics technologies to create a high-speed bridge between the electronic world and the photonic one: Ring-resonator and Mach Zehnder optical modulators, High-speed drivers, Phase Locked Loops and Voltage Controlled Oscillators for clock generation and clock data recovery, SerDes.
The technology is currently being covered by patents from University of Pisa and INFN.
The designed blocks are able to sustain high data-rates (10 Gbps in 65nm technology node, 25 Gbps in 28 nm) being robust to single event effects and total ionization dose.
The blocks are available both as integrated devices to be assembled on electronic boards or hard macro IP cores to be integrated in System-on-Chip solutions.

Tutti gli orari

Sunday 20 October
From 3.30 pm to 4.30 pm
3.STAGE3 pav. 3
RF and SiliconPhotonics Radiation-Hard Circuits for High-Speed Links in Aerospace and High Energy Physics Applications

Prof. Sergio Saponara, Ing. Gabriele Ciarpi

Sergio Saponara received the master’s (cum laude) and Ph.D. degrees in electronic engineering from the University of Pisa, Italy. He was a Marie Curie Fellow with IMEC, Belgium. He is currently a Full Professor of Electronics with the University of Pisa. He is the Director of the Summer School Enabling Technologies for IoT, responsible of the I-CAS lab and of the Crosslab Industrial IoT, and CTO of Ingeniars srl, Italy. He co-authored about 300 scientific papers and holds 18 patents. He is VP of the BSc and MSc degrees in Electronic Engineering at University of Pisa, representative of University of Pisa in the associations MOVET, research center UCAR, EERA smart cities JP. He is Funding Member of the IoT SiG of IEEE CAS and SP societies. He has been the Technical Program Committee Member of over 100 international IEEE and SPIE conferences. He is an Associate Editor of many IEEE, Springer, IET and MDPI journals. He is an IEEE IMS Distinguished Lecturer (2017–2020). He has been the responsible of many projects, among them for the H2020 European Processor Initiative (120 MEuro budget in 5 years, within the EuroHPC roadmap) for he is member of the steering committee, scientific leader of the automotive stream and of the workpackage on cybersecurity implementation, and leader of the University of Pisa.

Gabriele Ciarpi received the bachelor’s and master’s (cum laude) degrees in electronic engineering with the University of Pisa, Italy, where He is completing his Ph.D. in Information Engineering. He collaborated with Research and Development labs of international instutues, like INFN and CERN, and companies, such as Valeo and AMS. His research fields include the design of integrated circuits, EMC and rad-hard problem analysis, and the design of RF and high-speed transceivers.


Category Talk & Conference · Type Talk
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